Unusually high leakage currents have been measured in test wafers produced by the manufacturer SINTEF containing 3D pixel silicon sensor chips designed for the ATLAS (A Toroidal LHC ApparatuS) and CMS (Compact Muon Solenoid) experiments. Previous data has shown the CMS chips as having a lower leakage current after processing than ATLAS chips. Some theories behind the cause of the leakage currents include the dicing process and the usage of copper in bump bonding, and with differences in packaging and handling between the ATLAS and CMS chips causing the disparity between the two. Data taken at SLAC from a SINTEF wafer with electrodes doped with diborane and filled with polysilicon, before dicing, and with indium bumps added contradicts this past data, as ATLAS chips showed a lower leakage current than CMS chips. It also argues against copper in bump bonding and the dicing process as main causes of leakage current as neither were involved on this wafer. However, they still display an extremely high leakage current, with the source mostly unknown. Show Partial Abstract